Products

QuickLink™ Wafer-Handling System

The QuickLink™ wafer-handling system from BlueShift™ Technologies, consisting of patent-pending, vacuum robotic hardware and software modules, offers next-generation vacuum-processing technology that semiconductor OEMs and fabs need to exploit the opportunities raised by the growing demand for ever-smaller, faster chips—and the equipment capable of manufacturing them.

The QuickLink system maximizes the use of industry-proven components with high reliability and short lead times. QuickLink robots are designed for 20 million MCBF and have advanced features: automatic correction of wafer position and hard-wired interlocks to slot valves. With no motor windings, bearings or encoders in vacuum, the QuickLink robot minimizes vacuum surface area, resulting in very low out-gassing and reduced molecular organic contamination.

Linkable + Adaptable = Affordable
The QuickLink wafer-handling system's unique linkable and adaptable architecture makes it substantially more affordable than legacy platforms:

Linkable
The QuickLink wafer-handling system:

Enables linear processing by removing wafers from rear of system: improving throughput and yield Allows for small lots without cross-contamination Permits throughput balancing: more efficient use of equipment Reduces risk: fewer pump/vent and heat/cool cycles reduce thermal stress and particle contamination Accommodates change: providing a common foundation for growth-across applications Capable of supporting virtually unlimited number of process modules: 1 to n process chambers Reduces empty process facets or unused automation

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Adaptable
The QuickLink wafer-handling system:

• Accommodates integrated metrology for in-process monitoring of key parameters
• Solves today's technology requirements: works with existing OEMs process modules and system software
• Capable of handling next-generation, highly integrated vacuum processing
• Promotes reliability: key elements of system based on industry-proven, best-of-breed technology
• Supports "bolt-on" options to meet any process requirement
• Supports adaptable vacuum processing; mix multiple processes on a single platform:
  • Chemical vapor deposition (CVD)
  • Physical vapor deposition (PVD)
  • Etch and ashing
• and more…

Affordable
The QuickLink wafer-handling system:

• Promotes lower cost of ownership (COO):
  • Lower development and engineering costs
  • Lower operational costs
• Accelerates the "'commoditization' of customization" by employing standard, off-the-shelf components:
  • Open-integration architecture
  • OEMs can cost-effectively customize platform to meet fab requirements
  • Promotes economies of scale, making possible a cost-effective common platform